So I've been thinking about this and I think I've come up with a solution. So long story short I think a BGA to LGA conversion would work, because we will be adding extra thermal mass so to speak.. i beleive ive the main reason the solder on the bga gets so hot is less to do with pulling heat off the die and more about pulling heat from the underside of the cpu package, the PCB used in the original 360 and ps3 aren't very thick and there probably isn't much copper (large planes of copper) directly unde the processors to pull the extra heat out from the under side of the processor.. so the idea here is to use a custom LGA socket mounted to the stock Pcb using bga (99% of LGA sockets are mounted via bga), the extra copper ect should prevent the motherboard from getting hot enough to mess with the solder thus no hardware failure.. now ow for the processor side of things, there are two methods I've thought of: 1. We make a LGA socket with a 1:1 pin ratio to the original pads on the processor (so no need to modify the processor) 2: create a small Pcb to sort of break out the processor pins to match the LGA socket (my thinking is a 1:1 socket may be too small to manufacture, plus the added Pcb will add some more mass to disperse heat) apart from preventing RROD a method like this May be handy too modders when it comes efuses and cpu swaps
I am sure that this method will prevent RROD. However, there are many problems. Even designing the LGA socket would take a huge amount of work. Has any console even been modded with an LGA socket ? This would have been a more realistic idea if it was 2009, when JTAG just came out and a lot of people still had the old 360's with RROD's. And no hacking team will design this, because the 360 is soon to be irrelevent. And if you get a good quality reball, I don't think you should get a RROD at all.
Depends on the pin pitch and layout.. There probably is a mobile socket withy the same specs (we aren't changing CPUs so no need for pinout worries) my my idea is more of collectors in mind, we don't want another jaguar haha Bgas with lead solder still fail, it's not the solders fault (the original Xbox used lead free bags but never really had any faults relating to that)
Or reball with solder that isn't crap. There's absolutely no reason to socket something that doesn't have upgrade potential IMO.
The boards dont get hot enough to mess with the solder as it is - lead free solder melting point is like 200C. Its just that lead free solder is more brittle, when the board heats up (30c, what ever) it moves a little - thermal expansion. When it cools, it moves again. Eventually the solder starts to snap and you get a disconnection.
I had a 2005 xbox 360 a about a 2 years ago had it reballed with lead solder 2 years on still works had the heat sink upgrade to the 2009 head sinks never had a problem.
I would buy a Xenon or Zephyr now only if it had JTAG. You can RGH any xbox besides the Xenon and Zephyr (and the just released Winchester boards)
