Hi there. So I have one idea, in 2007 some people the idea, I mean a project called free60. Now we can run Linux on our xenons and other xbox The point is, perhaps for Jasper? I can hear but can also ... What we can do with Linux on our free60? For example, FTP server etc. .. The platform is not too expensive, so we can use it to ProFTPD, Apache, etc. .. Xbox have a great CPU, such as the PS3, but PS3 did not have enough RAM XNA Kit has 1GB of RAM, so you can do the mod (additional 512 MB) in the retail Jasper? anyone have scans of the XNA kit motherboard? Retail jasper got empty slots for additional RAM, maybe we should try to solder additional 512MB RAM and check? XBOX60 with 1GB of RAM, and Linux is cool, for example, I use it to crack WiFi networks using an external USB WiFi on Atheros AR9271 Can anyone help with the difference between the 1GB and 512MB jasper motherboard? EDIT: should sounds good now
You can't just solder on more ram to a retail jasper, there is no software on a retail to pick up and use the extra ram. Also even if you did solder on more ram and got the console to use it, all games are programed to work with the 512 mbs of ram and wouldn't use the full 1gb.
I'm actually working on this right now. I'll be getting the ram soldered on within the next week or two. By then hacker360 will have some board scans up to show if there are any other little things that need to be added. If you get any information/pictures about this, please share it. I posted almost this exact question on XBH, nobody replied over there. Also, you can use imagexex to alter the PE and rebuild the xex to have all 928mb dedicated to the title. I know you want it for linux use, but the option is there.
That just sound a bad idea. Why did Microsoft removed the 4 ram chip underneath the motherboard. To prevent RROD, but go and try and succeed my friend.
PCB flexing from heating/cooling cycles would do that ram in eventually I would imagine (and pretty sure it was what created the RRODs generated by the RAM), at least the solder joints from lead free solder that tends to be brittle in the first place. Using leaded solder is a better idea due to being somewhat more flexible as per my understanding. There are ways to help negate the failure. I would have to wonder if dropping RAM chips of a higher density in place of what is already there would work. I'd lean towards 'maybe' seeing as the drop from x to x-4 for RAM chip count means that it can handle a higher density set of chips. Might be worth finding something compatible with a higher density than it currently possesses. If the possibility of maybe creating an RROD sometime in the future is the only arguement you have against attempting this you'll find plenty of holes in that sieve. Besides, the most obvious reason to lower part count for anything is cost cutting measures. RRODs are a good thing to prevent overall but I sincerely doubt Microsoft reduced the RAM count solely to reduce RRODs when there are other factors at fault.
