I recently took my 30000R (GH-015) apart for cleaning and now have a question related to some of the thermal pads. The huge piece covering the EE, GS and RAM is about 1.2mm measured as it came out of the system, i got 1.5mm thermal pads on hand which should work nicely there. However, there are three chips (labelled IC802 Driver, IC803 Spindle Driver and IC407 Switching Regulator in the service manual) which had some real thick pads on (at least 2.3mm measured) which turned into stone over time with one of them breaking (not tearing) in half upon trying to get it off the chip. My question now is, how much would i want those chips to get replacement pads on? The system will be almost exclusively used with a HDD (i did give the optical drive a clean but it was very picky to begin with) and from what i can tell, the pads that came off will be as good as anything for getting heat off. My intuition tells me that both 802 and 803 would get at least warm during optical drive use (and 407 would get at least lightly toasty?), but id like to get a second opinion on that. Image of board with ICs marked as reference, orientation should match the one in the service manual, page 25
I used a pair of calipers for this, just be careful that you dont put any pressure on the pads while measuring, because the pads will compress and your reading will be off. If you cant get a certain thickness, opt for one size larger, the compressibility will take care of it.
Yeah i will take photos of most ps2 models and then upload the size gudies for ba chips and the cpu and gpu.
thats a good idea. thermal pads are usually the one thing you will not find info on anywhere. on that note, for those three chips i mentioned in the OP, i just went with two 1.5mm pieces to get 3mm, hacky, but has equal or greater transfer capacity compared to the bricks that were there before